INTERMOLD Die & Mold Asia TOKYO 2027 next edition date updated

From April 14, 2027 until April 16, 2027
https://www.intermold.jp/english/outline/

INTERMOLD / Die Mold Asia / Japan Metal Stamping Technology Exhibition / AM EXPO TOKYO 2027

This comprehensive manufacturing technology exhibition features three concurrent events focusing on advanced manufacturing processes, cross-industry exchange, and business matching.

  • INTERMOLD & Die Mold Asia: Showcases die and mold technology, metal stamping, component machining, and ultra-precision processing.
  • Japan Metal Stamping Technology Exhibition: Dedicated to metal stamping technologies and related equipment.
  • AM EXPO: Focuses on additive manufacturing and 3D printing technologies.

The event also hosts the FADMA International Conference, gathering representatives from Asian die and mold associations. Educational programs include keynote addresses, technical workshops, and business matching sessions. The exhibition expects around 40,000 visitors.