IC & Sensor Packaging Expo Tokyo 2027

Name: IC & Sensor Packaging Expo Tokyo
Start: 2027-02-17
End: 2027-02-19
Location: Tokyo - Tokyo Big Sight, Tokyo, Japan

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From February 17, 2027 until February 19, 2027

At Tokyo - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html

Categories: Packaging Industry

Tags: IC, Manufacturing, Packaging, Electronics, Materials, Semiconductor, Equipment, sensors, exhibition, technology

IC & Sensor Packaging Expo is a specialized exhibition for IC final manufacturing, gathering advanced equipment, materials and services. The expo is listed as a concurrent show at NEPCON JAPAN Tokyo. The 2027 Tokyo edition runs February 17–19, 2027, from 10:00 to 17:00 JST at Tokyo Big Sight, Japan. NEPCON JAPAN is organized by RX Japan GK. The event provides a focused venue for professionals in semiconductor assembly, packaging technology and related manufacturing fields to review products, meet suppliers and learn about industry developments.

Register for entry or booths

Please register at the organizer website of IC & Sensor Packaging Expo Tokyo

https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html

Venue Map and Hotels Around

Tokyo - Tokyo Big Sight, Tokyo, Japan