Microelectronics Packaging & Integration Symposium 2027

Name: Microelectronics Packaging & Integration Symposium
Start: 2027-02-09
End: 2027-02-11
Location: Millbrae - The Westin San Francisco Airport Hotel, California, United States

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From February 09, 2027 until February 11, 2027

At Millbrae - The Westin San Francisco Airport Hotel, California, United States ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://smta.org/mpage/wafer

Categories: Engineering Sector, Packaging Industry

Tags: Packaging, Semiconductors, Symposium

The Microelectronics Packaging & Integration Symposium is SMTA's flagship conference on advanced semiconductor packaging. Formerly the Wafer-Level Packaging Symposium, the event reflects the industry's shift toward wafer- and panel-level processes, 3D integration, heterogeneous assembly, advanced manufacturing, test, and metrology. The symposium brings together engineers, researchers, and suppliers to share technical sessions, keynotes, exhibition space, and professional development courses focused on packaging challenges driven by AI, HPC, and complex system designs. The 2027 edition is scheduled at The Westin San Francisco Airport in the San Francisco Bay Area, California.

Register for entry or booths

Please register at the organizer website of Microelectronics Packaging & Integration Symposium

https://smta.org/mpage/wafer

Venue Map and Hotels Around

Millbrae - The Westin San Francisco Airport Hotel, California, United States