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Semiconductor / Sensor Packaging Technology Exhibition 2025

Semiconductor / Sensor Packaging Technology Exhibition
From January 22, 2025 until January 24, 2025
Koto - Tokyo Big Sight, Tokyo, Japan
(Please double-check the dates and location on the official site below before attending.)

ISP - IC & Sensor Packaging Technology EXPO

Asia's leading exhibition for IC Final Manufacturing, gathering advanced equipment, materials and services. Members of the Conference Committee. Please contact us if you have any questions.

Following industry leaders have planned the session program for the Technical Conference.(As of February 6th, 2024. Honorifics omitted].

Organiser: RX Japan Ltd.NEPCON JAPAN show management.

TEL: +81-3 6739-4102E-mail : For Exhibiting>>[email protected] / For Visiting>> [email protected].

These numbers are estimates. These numbers could differ from those at the actual show.

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Register for tickets or booths

Please register at the official website of Semiconductor / Sensor Packaging Technology Exhibition

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan Koto - Tokyo Big Sight, Tokyo, Japan


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