Semiconductor / Sensor Packaging Technology Exhibition

Semiconductor / Sensor Packaging Technology Exhibition

From January 22, 2025 until January 24, 2025

At Koto - Tokyo Big Sight, Tokyo, Japan

Posted by Canton Fair Net

https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html

Categories: Electronics Industry, Packaging Industry

Tags: Packaging

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ISP - IC & Sensor Packaging Technology EXPO

Asia's leading exhibition for IC Final Manufacturing, gathering advanced equipment, materials and services. Members of the Conference Committee. Please contact us if you have any questions.

Following industry leaders have planned the session program for the Technical Conference.(As of April 19, 2024 [Honorifics are omitted].

Organiser: RX Japan Ltd.NEPCON JAPAN show management.

TEL: +81-3 6739-4102E-mail : For Exhibiting>>[email protected] / For Visiting>> [email protected].

These numbers are estimates. These numbers could differ from those at the actual show.