enarfrdehiitjakoptes

IC & SENSOR PACKAGING TECHNOLOGY EXPO 2025

IC & SENSOR PACKAGING TECHNOLOGY EXPO
From January 22, 2025 until January 24, 2025
Koto - Tokyo Big Sight, Tokyo, Japan
(Please double-check the dates and location on the official site below before attending.)

ISP - IC & Sensor Packaging Technology EXPO

Asia's leading exhibition for IC Final Manufacturing, gathering advanced equipment, materials and services. Members of the Conference Committee. Please contact us if you have any questions.

Following industry leaders have planned the session program for the Technical Conference.(As of February 6th, 2024. Honorifics omitted].

Organiser: RX Japan Ltd.NEPCON JAPAN show management.

TEL: +81 3 6739 4102E-mail : For Exhibiting>>[email protected] / For Visiting>> [email protected].

These numbers are estimates. These numbers could differ from those at the show.

Hits: 5526

Register for tickets or booths

Please register at the official website of IC & SENSOR PACKAGING TECHNOLOGY EXPO

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan Koto - Tokyo Big Sight, Tokyo, Japan


Comments

800 Characters left