IC & SENSOR PACKAGING TECHNOLOGY EXPO 2025
From
January 22, 2025
until
January 24, 2025
(Please double-check the dates and location on the official site below before attending.)
Categories: Electric & Electronics, IT & Technology
ISP - IC & Sensor Packaging Technology EXPO
Asia's leading exhibition for IC Final Manufacturing, gathering advanced equipment, materials and services. Members of the Conference Committee. Please contact us if you have any questions.
Following industry leaders have planned the session program for the Technical Conference.(As of February 6th, 2024. Honorifics omitted].
Organiser: RX Japan Ltd.NEPCON JAPAN show management.
TEL: +81 3 6739 4102E-mail : For Exhibiting>>[email protected] / For Visiting>> [email protected].
These numbers are estimates. These numbers could differ from those at the show.
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Venue Map and Hotels Around
Koto - Tokyo Big Sight, Tokyo, Japan Koto - Tokyo Big Sight, Tokyo, Japan
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