Jõuelektroonika tehnoloogianäitus 2024
Teave | ICEP2024
The ICEP 2024 event will take place in Toyama (Japan) from April 17-20, 2024.ICEP, the largest international electronic packaging conference in Japan, attracts more than 360 participants and hosts about 35 technical sessions. ICEP is a great opportunity to showcase your products and technologies, as well as grow your customer base. The event is sponsored jointly by JIEP and IEEE EPS Japan Chapter. The technical sessions cover a variety of topics, including advanced packaging and design, modeling, reliability, emerging technology, high-speed wireless and components, interconnections and materials, optical electronics, power electronics integration and thermal management.Since its inception in 2001, ICEP is a highly regarded electronics packaging conference held in Japan. It attracts world-renowned experts from around the globe in all aspects of packaging technologies.
Registreeru piletite või kabiinide saamiseks
Toimumiskoha kaart ja hotellid ümber
Koto – Tokyo Big Sight, Tokyo, Jaapan Koto – Tokyo Big Sight, Tokyo, Jaapan
Soovin uudiskirja