Electronic Packaging, Electro-Mechanical Solutions & 3D Day

ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS & 3D DAY - New Tech Events

ELECTRONIC PACKING, ELECTRO MECHANICAL SOLUTIONS AND 3D DAY. ELECTRONIC PACKING, ELECTRO MECHANICAL SOLUTIONS AND 3D DAY.

The Electronic Packaging, Electro-Mechanical Solutions & 3D Printing Conference and Trade Fair 2023 will focus on providing solutions for electronic system packing, will showcase innovations and solutions in the fields of connecting mother boards, environmentally-friendly innovations and solutions, packaging for vehicles, commercial and army packaging, racks and cabinets for communication applications and special environmental conditions, as well as packaging materials, fasteners, and solutions to heat removal and cooling, in racks and packaging, industrial designing, tools for content, simulation, analysis and environment test innovations, machining metal and plastic parts, machining, machining, machining, machining, machining, machining, machining, machining, machining, machining, a machining, machining, machining, machining, machinnovations, machining, machining, machining, machining, machining, machining, machining, machining, machining, analyzing, evaluating,,,,,, machining, and machining, machining, and standardized services,, machining, and standardization, machining, and, machining, and,, machining, and,,, and,,, and,,, and environmental testing,,,,, and,,,,, and,,, The conference will feature senior lecturers and guest lecturers, both from industry and academia, who will give lectures and present innovations in packaging, material, coating, and color fields, packaging solutions, production and speed modeling technologies, heat removal, cooling, electromagnetic compliance and EMI.