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SiP Conference China next edition date updated

From September 27, 2021 until September 29, 2021
At No.1 Zhancheng Road, Bao An, Shenzhen Categories: IT & Technology

This comprehensive annual gathering brings together excellent electronic system design and SiP packaging expertise, and includes assembly testing from OSAT, EMS, OEM, IDM, wafer-free semiconductor design companies, wafer foundries, and raw material and equipment suppliers.

The arrival of 5G and artificial intelligence (AI) technologies is having a huge impact on wireless networks, the Internet of things, automation and connected vehicles, automated smart cities, base stations, data storage, computing and networks.The conference and exhibition will focus on system-level packaging technologies that help reduce the cost of electronic component integration in small SiP packages.

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