NEPCON Asia next edition date updated
NEPCON ASIA 2022-Electronics Exhibition | SMT Show | Surface Mount Technology Expo | Automation Show
NEPCON ASIA 2022 will take "Crossover + Core + Smart Manufacturing" as its innovative concept. Upgrade the scale, record high number of people. Apply for a booth and take advantage of business opportunities. 2022 ICPF Shenzhen Semiconductor Packaging Technology Fair. Making electronics manufacturing easier!
Connecting electronic components, PCBA, intelligent manufacturing, advanced packaging and other electronic cross-border industry chains.
NEPCON ASIA 2022 is an innovative concept of "Crossover+ Core+ Smart Manufacturing", which will bring together 1,200 brands and exhibitors to show new domestic and international equipment as well as advanced technology solutions in electronic components, smart manufacturing, smart manufacturing, EMS, semiconductor packaging, testing, and PCBA processes. This show will link with multiple exhibitions during the same time, creating cross-border business opportunities.
More than 30 cross-border events covering PCBA, semiconductor packaging and intelligent storage and logistics will also be held over the same period. These include smart factory, industrial Internet of Things and machine vision. This event will provide a platform for Asia's cross-border business community to meet and create diverse domestic and international business opportunities.
All visitors to this year's exhibition will be required to register their real names and use a "personal ID card" to verify and exchange badges.