NEPCON Asia

NEPCON ASIA | Electronic Manufacturing Exhibition | PCBA process, intelligent manufacturing, EMS services, advanced packaging show

"Global circuit board assembly solutions" + "Semiconductor manufacturing technology". "PCBA & IC Packaging". 2024 Semiconductor Packaging Technology ExhibitionIC Packaging Fair (ICPF). Electronic manufacturing automation assembly solution. NEPCON ASIA Key Firgures 2024. 2024 IC Packing Fair. Exhibition Highlights. NEPCON ASIA Exhibitors. NEPCON ASIA Exhibitor Featured Area. Concurrent Exhibitions.

Connecting electronic components, PCBA processes, intelligent manufacturing services, advanced packaging and other electronic cross border manufacturing industry chains.

Shenzhen World Exhibition & Convention Center (Shenzhen World).

NEPCON ASIA brings together Asia's electronics manufacturers to show off advanced production solutions across industries, such as PCBAs, smart factories, semiconductor packaging, testing, automotive manufacturing, etc. To promote the upstream and downstream business cooperation in the industry, to enhance the global competitiveness for electronics manufacturers.

NEPCON2024 is an innovative concept "PCBA & IC packaging", which will bring 1,200 exhibitors and brand together to showcase new domestic or international equipments, advanced technology solutions, and electronic components related to PCBA processes and smart manufacturing. EMS services and semiconductor testing and packaging will also be featured. The show is linked to multiple exhibitions during the same time period. This will bring cross-border opportunities for business in consumer electronics, home appliances and industrial control. It also includes automotive, touch displays, new energy, medical equipment, optoelectronics and more.