SiP Conference China

半导体先进封装展|功率半导体封装展|电子展-第七届中国系统级封装大会•深圳站

This comprehensive annual gathering brings together excellent electronic system design and SiP packaging expertise, and includes assembly testing from OSAT, EMS, OEM, IDM, wafer-free semiconductor design companies, wafer foundries, and raw material and equipment suppliers.

The arrival of 5G and artificial intelligence (AI) technologies is having a huge impact on wireless networks, the Internet of things, automation and connected vehicles, automated smart cities, base stations, data storage, computing and networks.The conference and exhibition will focus on system-level packaging technologies that help reduce the cost of electronic component integration in small SiP packages.