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SiP Conference China

From May 10, 2019 08:30 until May 11, 2019 18:00
At Shenzhen Convention & Exhibition Center Address: Convention & Exhibition Cente, FuTian CBD, Futian Qu, Shenzhen Shi, China, 518045
0755-88311466

http://www.cetimes.com/sip/en/index.html

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http://www.cetimes.com/sip/en/index.html
Categories: IT & Technology
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This comprehensive annual gathering brings together excellent electronic system design and SiP packaging expertise, and includes assembly testing from OSAT, EMS, OEM, IDM, wafer-free semiconductor design companies, wafer foundries, and raw material and equipment suppliers.

The arrival of 5G and artificial intelligence (AI) technologies is having a huge impact on wireless networks, the Internet of things, automation and connected vehicles, automated smart cities, base stations, data storage, computing and networks.The conference and exhibition will focus on system-level packaging technologies that help reduce the cost of electronic component integration in small SiP packages.

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