NEPCON Asië 2024
NEPCON ASIA | Elektroniese vervaardigingsuitstalling | PCBA-proses, intelligente vervaardiging, EBW-dienste, gevorderde verpakkingskou
"Global circuit board assembly solutions" + "Semiconductor manufacturing technology". "PCBA & IC Packaging". 2024 Semiconductor Packaging Technology ExhibitionIC Packaging Fair (ICPF). Electronic manufacturing automation assembly solution. NEPCON ASIA Key Firgures 2024. 2024 IC Packing Fair. Exhibition Highlights. NEPCON ASIA Exhibitors. NEPCON ASIA Exhibitor Featured Area. Concurrent Exhibitions.
Verbinding van elektroniese komponente, PCBA-prosesse, intelligente vervaardigingsdienste, gevorderde verpakking en ander elektroniese oorgrensvervaardigingsbedryfkettings.
Shenzhen World Exhibition & Convention Centre (Shenzhen World).
NEPCON ASIA bring Asië se elektroniese vervaardigers bymekaar om gevorderde produksie-oplossings regoor nywerhede te wys, soos PCBA's, slim fabrieke, halfgeleierverpakking, toetsing, motorvervaardiging, ens. vir elektroniese vervaardigers.
NEPCON2024 is an innovative concept "PCBA & IC packaging", which will bring 1,200 exhibitors and brand together to showcase new domestic or international equipments, advanced technology solutions, and electronic components related to PCBA processes and smart manufacturing. EMS services and semiconductor testing and packaging will also be featured. The show is linked to multiple exhibitions during the same time period. This will bring cross-border opportunities for business in consumer electronics, home appliances and industrial control. It also includes automotive, touch displays, new energy, medical equipment, optoelectronics and more.
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Plekkaart en hotelle rondom
Shenzhen - Shenzhen Konvensie- en Uitstallingsentrum, KwaZulu-Natal, China Shenzhen - Shenzhen Konvensie- en Uitstallingsentrum, KwaZulu-Natal, China
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